Development Of The Software For The Extraction Of The Frequency-dependent Electromagnetic Parameters(R And L)

The electric properties of interconnects and packaging are very important for the performance of high-speed integrated circuits. This thesis is oriented for the electronic modeling and parameters extraction of on-chip interconnects. A software is developed for the extraction of the frequency-dependent parameters R and L under such circumstance. It抯 user-friendly, powerful and easy for engineering application. The contents are arranged as followings: In chapter two, the method of electromagnetic parameters extraction is introduced; Chapter three illustrates how the software was designed and how to use it; In chapter four, results for various interconnects are compared with those given in the literatures or by other softwares.