Development Of Temperature Control System For Digitally Integrated Quantum Communication Band Entanglement Source

The source of quantum entanglement is the core resource in the field of quantum communication.There are many ways to obtain the source of entanglement.At present,one of the most effective ways to prepare continuous variable quantum entanglement is to use the second-order nonlinear process.Among them,in the process of preparing the entanglement source,it is very important to accurately control the temperature of the nonlinear crystal.When the temperature control system cannot accurately and stably keep the temperature of the nonlinear crystal at the optimum point,the efficiency of the nonlinear effect will decrease.The quality of entangled light sources has deteriorated.Therefore,this paper researched and developed a quantum entanglement source temperature control device based on the CHPSO self-tuning PID algorithm to better control the temperature of the nonlinear crystal.This paper studies the particle swarm algorithm and improves it.We first adjust the inertia weight to strengthen the global search ability of the algorithm.Then,the hybrid particle swarm is combined with the competitive particle swarm to fine-tune the search process,and the improved algorithm is easy to fall into the local optimal problem in the later stage,so that the PID parameter tuning process is more accurate.The optimized algorithm is applied to the quantum entanglement source temperature control system for simulation.The results show that compared with the GA,PSO and HPSO algorithms,the CHPSO algorithm can reduce the overshoot of the system to 0.001%,and the adjustment time to 0.0345 s.And the deviation of multiple runs is small,and the robustness is stronger.Design and build the hardware platform of the system.STM32F407 is used as the core chip,and the power supply,data communication,temperature detection,PWM output and other modules of the system are designed.The temperature control part uses the L298 N chip to output PWM signals to control the switching state of the MOS tube,thereby controlling the direction of the current flowing through the TEC,and realizing the heating or cooling of the TEC.At the same time,according to the actual needs of the system,the PCB of the circuit is designed,and the design is divided into a main board,a sensor board and an interface board.Completed the development of the system BootLoader to ensure that the system starts correctly and enables the operating system or applications to work normally.At the same time,Boot Loader supports firmware upgrades,which facilitates the upgrade and maintenance of system software in the future.Complete the design of the communication protocol of the temperature control system.The protocol is mainly divided into two parts.The first part mainly completes the model configuration of the equipment;the second part mainly completes the sending of control commands and parameters of the upper computer and the upload of status parameters and real-time temperature data of the lower computer.