| In recent years,the electronic industry has developed very rapidly,and various electronic and electrical products are developing in the direction of lightness,thinness,smallness,and speed.Therefore,higher requirements are put forward for the performance of rolled copper foil.Ordinary polycrystalline copper foil is less and less able to meet the requirements of industries such as lithium batteries and microelectronics in terms of electrical conductivity,heat dissipation and signal transmission.However,single crystal copper has excellent properties such as plasticity,conductivity and bending resistance.In order to develop high-quality and high-performance rolled copper foil,it is very necessary to study the single crystal copper rolling process.In this paper,based on hot-type continuous casting single crystal copper and ordinary polycrystalline copper,the evolution of microstructure and properties of single crystal copper and polycrystalline copper during rolling,recovery and electro-rolling are studied by tensile,microhardness and metallographic experiments.,And analyzed and summarized the evolution law of organization and performance.First,based on metallographic,tensile and hardness experiments,the evolution of cold-rolled single crystal copper and polycrystalline copper microstructure and properties are studied.Cold rolling experiments were carried out on single crystal copper and polycrystalline copper under the same conditions,and the influence of reduction rate on the microstructure and properties of single crystal copper and polycrystalline copper was analyzed,and single crystal copper and polycrystalline copper under the same conditions were compared and analyzed.The similarities and differences.Studies have found that the plasticity of single crystal copper is better than that of polycrystalline copper,but the work hardening phenomenon is more serious than that of polycrystalline copper;due to the large grain size of single crystal copper,uneven crystal deformation occurs during the cold rolling process,first on the upper and lower edges A deformation zone appears,and as the reduction rate increases,the deformation zone gradually spreads from the upper and lower sides to the center.Secondly,the microstructure and properties of single crystal copper with different reduction rates are analyzed,and the annealing mechanism of single crystal copper with72% reduction rate is studied.The annealing recovery of the rolled single crystal copper was studied by different processes.The recrystallization temperature range of rolled single crystal copper was determined,and the influence of annealing temperature and holding time on the structure and properties of rolled single crystal copper was studied.The study found that the recrystallization temperature of single crystal copper is about50℃ higher than that of polycrystalline copper;twin grain boundaries and grain boundaries appear inside single crystal copper after annealing.Although the plasticity is improved,it is more plastic,strength and hardness than the original single crystal copper.difference.Finally,the microstructure and properties of electro-rolled single crystal copper and polycrystalline copper are studied.Conducted electro-rolling experiments on single crystal copper and polycrystalline copper,analyzed the influence of voltage and frequency on the structure and properties of single crystal copper and polycrystalline copper,and compared the difference between cold rolling and electro-rolling.The study found that electroplastic rolling is beneficial to the uniform deformation of single crystal copper structure;under a pulse current with a voltage of 150 V and a frequency of 500 Hz and a pulse width of 10μm,the obtained single crystal copper has the best comprehensive properties of plasticity and strength.The above content mainly carried out some experimental exploration and theoretical analysis for single crystal copper and polycrystalline copper rolling.A new idea is proposed for the research of high-performance single crystal copper foil tape,which has certain theoretical significance and engineering value for the further application of single crystal copper and the further development of copper foil tape. |