Optimization Design Of Bond Head For Die Bonder

National security is unprecedented attention. And information security related chip industry has risen to the national strategic level. Integrated circuit localization rate is imminent. Chip localization of the big trend has been irreversible. Semiconductor packaging equipment is the basis for the development of China's IC industry. And the advanced packaging equipment technology is in a backward state. After loading the semiconductor package equipment requires high speed, high speed machine and high precision positioning system performance. Bonding device is the key module of the high-speed die bonder. Undertake semiconductor devices on the chip pick and place. Flip chip bonding also need to in the high-speed SMT process achieve soft landing. Bonding apparatus capable of providing "hardness with softness" pressure to the chip. The voice coil motor with high speed and high precision motion control has been widely used in the wire bonding machine, adhesive film, wafer, wafer, and component detection. The China Electronics Technology Group Corporation No. 45 Research Institute developed high-speed threading machine(Ministry of science and technology 02 special) depending on the design a new high-speed die bonder bonding device, the device can realize the function of pick and place chip, flexible pressure control and fast response etc.. The electromagnetic field is analyzed by traditional magnetic circuit method and finite element method, and the magnetic field distribution, air gap magnetic density and magnetic saturation are visualized, which provide theoretical basis for optimal design of the device. A lot of heat is generated in the work of the electromagnetic mechanism. The temperature field of the device is simulated by three dimensional temperature field. The temperature field distribution is given, and the temperature field is analyzed. This has important strategic significance and economic value to the key technology of our country, the key technology of the flip chip bonding process, the technology gap between the foreign equipment, the core competitiveness of China's packaging equipment, and the rapid development of China's advanced microelectronic packaging technology.