| As fast development in MEMS field, the MEMS devices are more and more complex, and the manufacturing technology for MEMS is developed rapidly, too. On the other hand, the design technology for MEMS is relative laggard. As one of important content for MEMS CAD, the process integrated design is very important for improving the MEMS design level.In this paper, the methodology for the process integrated design and the crystalline silicon anisotropic wet etching simulation were studied at the support of country 863/MEMS fatal special project "MEMS design tools integration and application". The process integrated design methodology and flow for MEMS design was put forward. Besides, the model of the crystalline anisotropic wet etching was established and the simulation program was developed.Firstly, according to the conception MEMS process integrated design, the systemic frame of the process integrated design is analyzed in detail. The methodology of process integrated design based the mask layout and the 3D solid model was put forward.Secondly, taking the crystalline silicon anisotropic wet etching for example, the anisotropic wet etching model based dynamic cellular automata algorithm and the Seidel's electrochemistry etching model was established after analyzing the micro-structure of the crystalline silicon and the principle of anisotropic wet etching. The simulation program based VC++ language and OpenGL graphics library was developed, and the program can simulate the anisotropic wet etching of the rectangle layout.Thirdly, the design flow based the mask layout and the 3D solid model were respectively validated on the basis of the design of typical MEMS device —Z axis micro machining gyroscope.Finally, the total paper was summarized, and the development direction of MEMS process integrated design was simply discussed. |