Study Of Laser Die-cutting Technology

Nowadays, traditional mechanical die-cutting technology is used in packing industry in China. Wooden cutter-inserted die-board is used to process paper-based packaging materials in die-cutting machine. The die-boards are difficult to produce and modify, so the traditional die-cutting technology shows much more disadvantages for cartons with great varieties and small quantities.To solve the above problems, a new method of laser die-cutting technology is developed in this thesis. Using laser to process the surface of the bulk packaging materials according to the expanding pattern of the packaging carton in the computer, die-cutting and creasing process are capable of completing simultaneously. Non-contact process of laser replaces the traditional contact mechanical process, and there's no need for the die-board inducing lower production costs, higher speed and more convenience. This new die-cutting technology overcomes many disadvantages existing in the traditional ones in many aspects, especially for producing light, thin and anomalous cartons.First of all, the basic concept and process principle of laser die-cutting technology are expounded. By comparing with the traditional technology, the superiority of the new one is put forward. Afterwards, theoretical research is made further in the laser die-cutting technology, component selection and control technology. Based on the theoretical analysis results, RF CO2 laser is selected as the processing lamp-house for its outstanding beam quality, long operating lifetime, and simple way for working mode conversion from CW to Gated CW meeting the needs for laser power changing. Galvanometer scanning system is adopted to improve the process speed, and F-θlens is selected as focus component for image-field correction. To complete the large amount of storage and calculation, the RTC3 card based on DSP is adopted in this system for parallel running with the computer. Besides, this thesis puts forward two methods of changing scanning speed or laser power to complete die-cutting process. The software designed in the environment of VC 6.0 has polite interface and strong general availability. Based on test results, optimum parameters are selected for die-cutting experiments. Die-cutting samples match up with the requested, verifying the feasibility of the laser die-cutting system. The whole system runs smoothly in lab, making a good preparation work for practical production.