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1. Flow And Heat Transfer In Micro Fluid-based Inertial Devices And Their Engineering Applications
2. Study On Size Effect Of Induction Heatng And Characteristics Of Induction Heatng Interconnection Technology For BGA Packaging
3. Mosaic Of Sio <sub> 2 </ Sub> Dielectric In Si Nanocrystals, Preparation And Optical Characteristics Of El
4. Early Stage Interfacial Reaction And Undercooling Solidification Behavior Of Microscale Lead-free Solder Interconnects During Reflowing Process
5. Design And Study On Influence Of Size Effect To Spectra Of Organic Nonlinear Materials
6. Study On Silicon-Based Integrated Probe Technology And Micro/Nano Friction Effect
7. Research On The Dynamic Characteristics Of Microstructure In MEMS
8. Inner Cladding Fiber Doped With Nano InP And Its Amplification
9. Size Dependent On The Seebeck Coefficient Of Polycrystalline Thermoelectric Material And Optimal Design Of Segmented Thermoelectric Unicouples
10. Study Of Isothermal Aging And Electromigration Behaviors And The Size Effect Of Lead-free Solder Mirco-interconnections In Electronic Packages
11. The Mechanical Properties Of Silicon Nanowires Based On Mems Technology And Manufacturing Methods
12. Wireless Multi-sensor Networks - Micro Vibration Sensors
13. Solder Volume Effects On The Formation And Evolution Of Microstructure And Shear Fracture Behavior Of BGA Structure Cu(Ni)/Sn3.0Ag0.5Cu/Ni(Cu) Interconnects
14. The Research Of The Nano-semiconductor Materials Doped Amplification Fiber The Application Of UWB Signal Localization In A Sensor System
15. Study Of Electromagnetic Pulse In Intense Laser Pulses Interaction With Metallic Targets
16. Essential Physical Problems On Weak Optical-Elctronic Signals Tansporting Along Low-Dimensional Nano Structures
17. The Interfacial Reaction Of Solder Joint For Flip Chip Assembly With Cu/OSP Pad And Its Reliability
18. Research On Characteirstics Of Interconnect And Thermal Design Technology For Nanometer Chip
19. Research On General Design And Key Technologies Of Wuhan MF Radar
20. Study Of Size Effects On Mechanical Property, Fatigue And Electromigration Behavior Of Microscale Lead-free Solder Interconnects
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