Millimeter Wave MEMS Filter Research And Design

As the most important and most applied microwave passive devices,filters bear the heavy responsibility of frequency selection of communication systems.With the development trend of miniaturization of circuit equipment,people put forward higher requirements for filters,small size,selectivity,applicability and low price filters have become the current research hot direction in the field of microwave communications.This paper firstly introduces and studies the substrate integrated waveguide(SIW)structure,the transmission characteristics of SIW structure,the equivalent calculation of SIW structure and traditional rectangular waveguide,then analyzes the filter design process,the extraction of filter coupling coefficients and the extraction of quality factors and the calculation formula.In order to meet the demand of the miniaturization trend of equipment for filter size chip,statistical analysis of the advantages of SIW filter structure based on MEMS(Micro-ElectroMechanical System)process,based on this filter miniaturization,wide blocking band,high suppression system of the difficult research direction of different structures of the filter The design of a five-cavity filter chip in Ka-band is combined with the miniaturization of SIW filter technology,and a variety of wide upper-band bandpass filters are designed for the current 5G hot bands.The difficult direction of the filter high suppression system wide resistive band,designed a ultra-high suppression system ultra-wide resistive band dual passband filter.After completing the filter simulation design,the flow chip is carried out,and the important steps of MEMS process are introduced and studied.By analyzing the MEMS technology and process details,the MEMS filter process steps are designed by combining different filter structures in this paper,and finally the physical processing of the filter is completed.Physical probe tests are performed on the finished chip completed by the flow chip,and after comparing the overall design process,the problems arising from the flow chip are identified through analysis.The study of Ka-band millimeter wave test board was carried out to meet the demand of high-volume millimeter wave device testing.By understanding the basic parameters and structure of bonding wire and matching,the effect of bonding wire parameters on signal curve was studied in simulation,and the problem of the number of bonding wire roots was solved reasonably by constructing a coaxial device model,completing the coaxial device and matching structure in joint imitation,and using Altium Designer software to The PCB board model is built,and finally a millimeter wave test board in Kaband is designed and realized.