A Research And Design Of A Stack Flip Chip QFN Package

Nowadays,with the rapid development of portable consumer electronic products,portable mean that the size and thickness of the electronic products are becoming smaller and thinner.This also requires that the volume of IC chip is smaller and smaller,and the function is more and more complex.Currently there are two solutions:the first is use more advanced wafer process to reduce the size of chip;the second is packing chips with different functions into a single package.The second solution has a shorter cycle time,lower cost and lower initial investment than the first solution.Therefore,it is an important topic of select the appropriate packing technology and package type.This paper introduces the study of package technology which is packing with chip,resistor,capacitor and inductor with FCQFN lead frame.Based on the traditional FCQFN package design,this paper systematically analyzes the stacked inductor FCQFN,and proposes the design scheme of stacked inductor FCQFN,including product design,lead frame design,package process design,and reliability design.Then,the difficulties of stacked inductor FCQFN package were analyzed and improved,and proposes the solution for each difficulty.Taguchi experimental design and JMP were used to verify the proposed solutions.Finally,a comprehensive quality evaluation is made for the product,including the product dimension,electrical performance test and package reliability test results.