Used For PCB For High Density Interconnection Study On The Technology Of Copper Coin-embedded

The construction of 5G communication system relies on optical fiber communication technology.Optical module is an important functional device in optical fiber communication system.Optical module is an important component in modern optical communication system which is responsible for the realization of optical transmission and reception.It has a great influence on the overall communication quality of optical fiber communication system.In the information age today,people's quality requirements for network transmission are increasingly improving.As an important component of optical communication,the requirements for optical modules are also improved accordingly.How to make the optical module PCB(printed circuit board)with miniaturization,high speed and high thermal conductivity is the focus of this research.High frequency and high thermal conductivity optical modules can be prepared by anylayer(anylayer interconnection)and buried copper block technology to achieve the goal.HDI(high density interconnection)is the basic technology of Any Layer implementation,and it is an important technology to improve PCB transmission rate.Buried copper block technology is a new thermal conductivity technology of PCB,which can be achieved by embedding copper block inside PCB.In this paper,the interconnection between any layers is realized by preparing a 4-order HDI PCB to achieve the high frequency transmission goal.Study and prepare copper coin-embedded PCB to achieve the purpose of high thermal conductivity.First of all,the realization of HDI is based on blind hole stacking.In this paper,the key influencing steps of blind hole production,laser drilling and electroplating hole filling,are experimentally verified,and the optimal methods and parameters of laser drilling and electroplating hole filling for blind hole production are discussed.To meet the reliability requirements,and on this basis,the printed circuit board of stage 4 HDI is made.The experimental results show that the laser drilling method using direct laser drilling method is better than the same window laser drilling method in blind hole production capacity,and the leakage filling rate is only 121 PPM.The completed samples meet the reliability test.After 5 times of thermal stress float tin,there is no failure.The maximum resistance change rate of TCT test is 5.72%,and the maximum resistance change rate of reflow test is 4.57%.Secondly,in the copper coin-embedded PCB.This paper demonstrates the influence of the improvement of copper block Browning mode and the matching of copper block and gong groove size on the reliability of buried copper coin-embedded PCB.Finally,the key design of the dimensions of copper coin-embedded PCB is summarized.The Browning yield can be increased from 71% to 97% after the improvement of copper block Browning tools.The study on the size of copper block and gong groove shows that the copper block should be selected as the material with the height 0.05 mm higher than the theoretical laminae,the length and width 0.1mm smaller than the gong groove size on one side and the overall size 0.2mm smaller than the gong groove size.The test results are the best,the height difference of flatness is 9um,the uniformity of copper thickness is controlled at 3.2um,and the uniformity of plate thickness is controlled at 0.046 mm.After assembly,the device works at room temperature,and the maximum working temperature after simulation is 53.9 ?.The performance parameters of the device are TDECQ 0.73 db,OMAouter 460 MW and RLM 0.987.