Design And Optimization Of Carrying And Clamping Device Of Wire Bonder

At present,the semiconductor industry,as a national key development industry,is directly related to the national industrial level.The technological upgrading of the semiconductor industry promotes the development of emerging industries to a certain extent.As a research field of semiconductor industry,LED packaging technology has been developed rapidly in recent years,but due to the late start and less technology accumulation in China,the overall production efficiency of domestic wire bonders is still low.Improving the feeding speed,positioning accuracy and bonding speed of support is an effective way to improve the production efficiency of wire bonders.The main task of this paper is to design the feeding clamping mechanism and optimize the key parts.The specific design and optimization contents can be summarized into several aspects :(1)The design of feeding and clamping mechanism mainly includes making preliminary design scheme according to the working principle and design requirements of wire bonder.The modular analysis of demand function is carried out,and the parts of pushing module,clamping module and other modules are designed,as well as the selection of standard parts.2)The stress analysis and Simulation of the important supporting parts such as the guide micro adjustment supporting parts in the feeding clamping mechanism are carried out to obtain the equivalent stress and deformation of the important parts and verify its reliability.(3)According to the working condition of the pressing claw in the wire welding machine,the theoretical analysis of the force and deformation of the pressing claw is carried out.3D modeling is carried out by using Solid Works software,and then static analysis is carried out by using finite element software.According to the stress and displacement nephogram of pressing claw node,the influence of pressing claw stiffness(deformation)on the support force is analyzed,and then the topological optimization of pressing claw is carried out.Then the performance of the optimized pawl is compared with that of the optimized pawl.(4)According to the working condition of the pressing plate in the welding line machine,the heating and stress of the pressing plate are analyzed.Based on the parametric design modeling of the press plate,the correlation analysis of the parameters of the press plate is carried out by using the finite element method.Six main parameters influencing the deformation of the press plate contact surface perpendicular to the support are selected from the 11 size parameters of the press plate.Then,the maximum and minimum response surfaces of the six parameters and the deformation are established.At the same time,the response surface is verified by verification points,and the difference between the two response surfaces is optimized to select the optimal parameter array for verification.