Research Of Highly Reliable Communication Mechanism In 3D Integrated Circuit

TSV(Through-silicon Via)meets the needs of high speed and low power consumption applied to 3D-ic interconnection,and such technology has become a hotspot nowadays.However,high density of TSV implementation exacerbates crosstalk noise in system which affects the signal reliability.Research of highly reliable communication mechanism in 3D-ic has taken a widely concern from industry.For the above reason,this paper proposes two algorithms focusing on noise decreasing.I firstly propose Ground TSV Insertion scheme to isolate signal TSVs,which avoids transition interference between 2 TSV pairs.Modified Liu algorithms is used to optimize the number and location of Ground TSVs.Later,we propose a crosstalk avoidance scheme based on re-layout of signal TSV.Due to temporal and spatial locality of signal transmission,some signal TSVs can be used for shielding.Capacity model of 3×3 TSV bounds is derived later.Transition delay and BER are quantized based on capacity patterns classification,and those can be used in algorithm evaluation.Two parameters,crosstalk index and unshielded index,are proposed in this paper to describe the shielding effect of signal TSV re-layout.Both of the indexes are optimized by using non-dominated sorting genetic algorithm II(NSGA-II).We implemented our scheme based on SPEC2006 trace-driven simulation.Result shows that the number of transmission patterns that cause worst crosstalk decreases by 28.8%.And transmission time is reduced by 14.8%.Compared with other algorithms,our work achieves the same or even better results without redundancy TSVs.I implemented the algorithm on circuit.Extend it to 3D circuit and complete backend flow and use real signal for verification and resource evaluation.