| Embedded siloxane polymer waveguides have shown promising results for use in optical backplanes. They exhibit high temperature stability, low optical absorption, and require common processing techniques. A challenging aspect of this technology is out-of-plane coupling of the waveguides. A multi-software approach to modeling an optical vertical interconnect (via) is proposed. This approach utilizes the beam propagation method to generate varied modal field distribution structures which are then propagated through a via model using the angular spectrum propagation technique. Simulation results show average losses between 2.5 and 4.5 dB for different initial input conditions. Certain configurations show losses of less than 3 dB and it is shown that in an input/output pair of vias, average losses per via may be lower than the targeted 3 dB. |
