Design And Implementation Of The Large Capacity And General FPGA Configuration Memory

With the rapid development and continuous change of the domestic integrated circuit industry,the integrated circuit industry is supported by the core technology of strategic,basic and leading industry development.The scale of the industry is constantly expanding,and the application environment of integrated circuits is also being manufactured.The medical,communications and other industries have been widely promoted.Field Programmable Gate Array(FPGA)field-programmable gate array devices are widely used in many fields due to their many resources available to users in the application environment and flexible and programmable application characteristics.Most of the FPGAs on the market are designed based on the architecture of the RAM configuration.The design is used to divide the cells for storing the power-on configuration data.Therefore,when using FPGAs,applications usually need to be used with one or more dedicated devices.Non-volatile Flash memory is used to configure the FPGA to perform its fast response.As the application environment continues to become more complex,the requirements for device resources and speed continue to increase,the design scale of FPGA devices is also constantly expanding,and the amount of configuration data required is also increasing.The use of conventional memory chips often requires Multiple stacks can be used together,which not only increases the area but also increases the complexity of the board design.Therefore,it is especially necessary for a large-capacity FPGA to customize a large-capacity storage.At the same time,the large-capacity storage device can be designed as a configuration device that can be commonly used for multiple or multi-series FPGAs,and the application of the storage device can be significantly expanded when designed as a general-purpose storage device with a large capacity.The market and the development prospects of such storage devices have increased.Through the analysis of domestic market demand,combined with the industry storage design framework and design ideas,this project realizes the memory chip that meets the market demand through forward design based on the existing process capability level.The subject first analyzes the feasibility of implementing a 128 Mbits memory device,and analyzes the design feasibility and design criteria of the subject to determine the standards and specifications of the chip that needs to be implemented.Through the analysis of the needs of the subject,the research direction of the subject,the function and the application environment,combined with the domestic process status,the purchase process provides the embedded Memory IP,and the design is realized around the IP design circuit.Through the design and implementation of the subject,the design and streamlet of the FPGA configuration memory of this kind are completed,and the design scheme and storage design framework of the large-capacity upper memory based on small-capacity storage is proposed.Based on the accumulated technical foundation and successful experience,the key technologies in the development of this project have more adequate research plans and countermeasures.Through the implementation of this topic,a forward design technology platform can be established to store in large-capacity FPGAs.The device design is self-controllable and realizes the localization of the memory chip.