Study On The Influence Of Water Jet Assisted Laser Etching Of Silicon Carbide

Silicon carbide materials are ceramic brittle materials.Due to their good thermal properties such as low thermal conductivity,corrosion resistance and high strength,silicon carbide materials have been widely used in machinery,chemical industry and cutting-edge technology.Ceramic materials are especially inherent in their properties.It is difficult to process them by conventional machining.It can easily cause defects such as cracking of materials and damage the tools.The development of laser technology provides a faster and more efficient processing method for the processing of silicon carbide materials.However,in the conventional laser processing,the softened material is blown off by the laser heating softening material under the action of the auxiliary gas,thereby completing the processing of the material.Excess heat acting on the surface of the material is transmitted to the material inside the material and around the laser action area by means of heat conduction,resulting in a large range of heat affected zone,abrupt phenomenon and poor processing quality.Water jet assisted laser processing technology has become a research hot spot in recent years.The introduction of water jet can effectively reduce defects such as large heat affected zone and improve processing quality.The water jet assisted laser processing technology is a water jet with a certain angle and speed on the basis of the traditional gas-assisted laser processing technology.In the whole composite processing technology,the laser mainly plays the role of heating and softening the material.Water jets have the effect of impact,transport and cooling.The impact of the water jet can promptly remove the material that has been re-solidified after laser processing and the melt that is not ready to solidify in time from the processing area(the groove in the text).The transport of the water jet can eliminate the material that is washed away from the groove.The cooling action of the water jet can absorb the excess heat acting on the material and reduce the heat affected zone.The research group has used the water jet assisted laser etching technology to etch the silicon carbide.It mainly studies the effect of the water jet maintaining a certain angle on the processing results.Therefore,based on the previous research,the paper mainly uses the control variable method to influence the laser parameters such as pulse width,current,repetition frequency and processing speed,water jet parameters such as angle and velocity on the processing results of silicon carbide.The article mainly studies from the following aspects:(1)Combining the literatures related to solution-assisted laser processing at home and abroad,the research status of three processing techniques of water-guided laser processing,underwater laser processing and water jet-assisted laser processing were summarized.(2)Analyzed the interaction mechanism between laser and solid material,the interaction between laser and water,the effect of water jet on material impact and transportation and cooling.(3)Using finite element software to simulate the influence of different laser power and laser moving speed on the surface temperature field distribution of materials.(4)Using finite element software to simulate the static pressure generated when the water jet angle and water jet velocity impact the surface of the material,the simulation and the actual combination optimize the reasonable water jet angle and speed.(5)Using water jet assisted laser etching processing method as the main research object.Using single factor experimental research method,researching and analyzing different laser parameters and water jet parameters to etch silicon carbide to obtain the depth,width,heat affected zone and the influence of microscopic morphology.