Research On Resin Layer Optimization And Manufactuing Technology Of Resin Diamond Wire

With the development of photovoltaic industry,the demand for silicon chips is increasing.Silicon slices is getting thinner and thinner,which brings great challenge to cutting tools.Resin diamond wire has many advantages,such as high chip quality,low production cost,small environmental pollution and simple manufacturing technology.It has been widely used in the field of hard and brittle material cutting.However,the hardness of the resin layer is low,the holding capacity of the diamond particles is insufficient,and the adhesion and thermal stability are poor,which reduces the service life of the wire saw.In order to solve the problems of resin wire saw,In this paper,the resin system has been studied,the characteristics of resin liquid and resin after curing were analyzed,adding filler to improve the capability of resin diamond wire.The main work and achievements of the paper:(1)According to the requirements of the use of resin,resin system has been established,different resins have been selected and resin solubility experiments have been done,and liquid of resin has been studied.The theory of resin curing has been analyzed,through the DSC curve,the curing temperature curves of different resins have been determined.The hardness,cohesional strength,heat resistance and cross-sectional compactness of cured resin has been analyzed.A higher capability resin has been chosen.(2)SiC has been selected as filler and treated by KH-550 surface,the effects of SiC,KH-550 and modified SiC content on the hardness,cohesional strength,heat resistance and cross-sectional structure of resin layer have been studied.It is found that the hardness and cohesional strength of resin layer increase with the increase of SiCcontent,when the SiC weight is 40% of the resin liquid volume,the hardness and cohesional strength of the resin layer reach the maximum value.At the same time,the distribution of SiC particles is relatively homogeneous,and there is not a lot of agglomeration.With the increase of KH-550 concentration,the hardness of resin layer is not increased.The cohesional strength first increases and then decreases,and the heat resistance increases.When the 6%KH-550 modified with SiC,the resin layer has the best mechanical properties,and the section density is better.When the weight of modified SiC takes up 40% of the volume of resin liquid,the hardness and cohesional strength of resin layer reach the best.(3)The process of resin diamond wire has been established,and the nickel plated diamond particles have been selected as abrasive particles,and the diamond concentration has been calculated,copper plated steel wire has been chosen as the baseline and surface treatment.Resin diamond wire has been produced by coating device.(4)The wire has been surface detection,the diamond particles are uniformly distributed,wire surface quality is better.The cutting test has been carried out,and the quality of the chips is good,compared with the commodity line after cutting,the results show that,own production of wire part of diamond shedding and no resin layer fall off.This shows that the wire saw good capability and has done analysis on the failure of wire saw.