| Phased array radar uses a large number of antenna elements controlled by independent amplitude-phase to form antenna array surface.By controlling the amplitude and phase of each element to form a specific direction beam of each element,the main beam is finally synthesized.Phased array radar has become the main developing direction in the field of radar detection,because of its advantages of multi-target tracking,multi-beam scanning,flexible pointing and high reliability,and has been widely used in spaceborne,missile-borne,airborne,ship-based radar and ground warning and tracking radar and electronic countermeasures,automotive anti-collision radar and other military and civilian areas.Transceiver module is the core part of phased array radar and the main control part of antenna radiation amplitude and phase.The performance of transceiver module is directly related to the performance of phased array radar,and is the main cost and volume occupation of phased array radar.The research of phased array radar transceiver module is of great significance in improving the overall performance of phased array,improving system integration,reducing cost and volume,etc.With the increasing integration of electronic systems and the rapid development of packaging technology,the traditional brick transceiver components with low integration,large volume and high cost have been unable to meet the requirements of development.The tile phased array transceiver module divides the multi-channel sub-array into several function modules according to the function,and each function module contains some functions of all the channels of the subarray.A method of realizing all functions of phased array transceiver module through vertical interconnection of all function modules.It has the characteristics of strong reconfiguration,high integration,small volume and low cost.It has become the main development direction of phased array radar transceiver module instead of traditional brick T / R module.In recent years,the main countries have carried on the research and development,but the domestic related research is still in the initial stage,therefore,the research of this paper can improve the development level of the domestic tile phased array radar module to a certain extent.In this paper,the following aspects of research are completed: This article completed the following aspects of research:(1)A design scheme of 4 × 4 X-band tile-shaped phased array T/R component based on SiP technology is presented.The SiP technology,such as LTCC technology,microchannel heat dissipation technology and vertical interconnect technology,is characterized by reconfigurability,high power density,high integration,light weight and small size.The single channel transmission power is more than 40 dBm,the max receiving gain is 17 dB,the RF part size is only 58 mm × 58 mm × 2.3 mm.(2)In order to solve the problems of heterogeneous integration and signal interconnection in SiP packaging,a variety of interconnected structures and two different power separators are proposed for the field distribution and field transformation in the transmission process.The low loss transmission of microwave signals in the 3D encapsulated T/R component is realized.Based on bridge principle,a new type of wideband power subdivision network based on Y bridge and Wilkinson power divider is developed.The operating frequency is covered with X band,isolation is greater than 13 d B,insertion damage is less than 0.2 dB and port balance is less than 0.1 dB.(3)According to the thermal management problem of high power and high power density,based on the analysis of flow heat transfer and thermal stress,a kind of heat dissipation method,water-cooling microchannel heat sink,which can be used for high power density components is proposed.When 300 W heat dissipates,the maximum surface temperature does not exceed 90 ?.The contradiction between the heat dissipation performance of the LTCC substrate and the size limit of the phased array components is solved. |
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