The Research Of Defect Reduction Method In Wafer Industrial Production

With the development of human and the progress of science and technology,the development of IC chip industry is extremely rapid.In recent decades,the application of silicon-based semiconductors has greatly promoted the rapid development of modern social productivity level.The invention and development of ultra-large IC have led to the technological progress of life,material and cultural level had a profound change.Over the past 30 years,the computer's performance increased by 10,000 times,but the price has dropped to the original 1/10000.The increase in the number of transistors is achieved by continuously reducing the CD of the transistor,from 1990 s of 0.5um,0.35 um,0.25 um,0.18 um has been developed to the current 90 nm and below.In the entire IC chip manufacturing,defect detection and improvement is an important issue,the relationship between product yield and the company's revenue.To find and improve the defect issue in time,to reduce the influence of impact,and to grasp the baseline defects,which is a set of excellent defect detection system must be done.This paper mainly studies the tools and methods of defect detection system,including the principle and method of defect detection equipment KLA and AIT,and extends to defect analysis method,trend chart,defect library and defective monitoring system of designated time equipment to study defect analysis and improvement optimization.Through the research,achieved the desired results,and in the actual industrial production has played a huge role.Using the available detection methods and system resources,several abnormal defect patterns are dealt with.Reasonable detection and effective method,can improve the overall efficiency of the work,but also speed up the feedback speed of the defect and the focus of the machine defects monitoring.