Failure Mechanism And Pressure Resistance Of Chip Solid Electrolyte Tantalum Capacitors Under Different Conditions

Chip solid electrolyte tantalum capacitors are widely used in electronic equipment because of its small size, large capacity, low leakage current, high reliability, long life and so on. However, because of the demand of high voltage performance, there are many kinds of quality.At present, most of the chip solid electrolyte tantalum capacitor failure is closely related to the production process and the use of the method, and as a manufacturer of electronic components, as far as possible to analyze the causes of the breakdown of tantalum capacitors, and the performance, to improve the reliability of chip solid electrolyte tantalum capacitors become our urgent research content. Chip solid tantalum electrolytic capacitor is the reason that to obtain the widespread application, in addition to tantalum capacitors tantalum and its oxide film of high physical and chemical stability, large capacitance, temperature characteristics and advantages, an important advantage is the chip tantalum capacitor flash fire breakdown may occur when the self healing and return to normal and Mn O2 can in tantalum pentoxide due to oxygen migration so that the leakage current increases as the supplementary oxygen atoms and maintain pentoxide Ta2O5 molecular stability and maintain the stability of the leakage current, ensure the reliability of the capacitor.The chip tantalum capacitors in the factory before the screening, testing, testing process in the flash fire caused by the impact of the reliability of the product, whether the special test method to remove the flash fire, the product, the use of constant current diode aging technology whether it will be beneficial to the development of the product, the use of the product life cycle, the use of large, short circuit, resistance to wet test short circuit and so on.Through this research, access to the Flash Heal and on chip tantalum capacitor reliability of important conclusion, chip tantalum capacitors of the flash fire breakdown voltage with the charging current and temperature rise is on a downward trend, at the same time according to the analysis of data and theory to analyze and judge the constant current diode tube aging technology easily lead to chip tantalum capacitor breakdown after the self-healing, affect subsequent use of reliability. Through on a flash fire self-healing and not by flash fire self-healing two groups of product reliability comparison of test data analysis, flash fire self-healing products by temperature, solvent, Weibull accelerated life reliability after showing a significantly higher probability of failure in that production and screening of flash heal on long-term working reliability of the tantalum capacitor has some adverse effects, it is proposed to cancel the constant current diode burn-in this is not conducive to sift out the bad products process.Through the research of this thesis, we put forward the effective reliability evaluation and test method, which has the important significance to improve the quality of products, reduce the failure probability, improve the reliability of the equipment, improve the technical level and market competitiveness.