The Study Of Indium Sealing Ingtechnology For OLED

In recent ten years, the development of OLED technology is very rapid on a global scale. OLED devices have many advantages, such as ultra-thin, ultra-light, high luminous efficiency, self-light emitting, response speed, low energy consumption, and can be used for the flexible display, etc. It’s not just a kind of ideal lighting material,but also is hailed as the superstar of the next generation of display devices in the field of display devices. At present OLED devices is not perfect. It exists many defects, such as its low rate of good product, short service life and so on. That seriously hampered the commercialization process of OLED devices. The problem of how to improve the service life of OLED devices has been a research hot spot in the world. And the most direct and the most effective method of improving the service life of OLED devices is the effective encapsulation of OLED.This paper firstly introduces the development process of OLED device and the development trend of the device.And analyzes the advantages and disadvantages of OLED with respect to other display devices. Then comes to the conclusion that the key to accelerate the commercialization process of OLED is improving the service life of OLED devices.In the second chapter, the structure and principle of OLED are described in detail.And we analyzes the failure mechanism of OLED and its main external factors. Then this paper studies a variety of methods for OLED encapsulated,A scheme of completing the OLED device encapsulated with indium sealing technology is summed though analyzing the advantages and disadvantages of many different encapsulation methods of OLED.In the third chapter, this article firstly introduces the proficient application of indium sealing technology in the field of electric vacuum devices. Then the encapsulation of the traditional hot melt indium sealing technology for OLED is analyzed and summarized, though that we find the advantages and disadvantages of the hot melt indium encapsulation process in the encapsulating of OLED.In detail, we design a new scheme for using laser heating to encapsulate the OLED devices, and point out that the technical difficulty of the scheme is how to design a laser heating device.For the key issues in the encapsulation,in the fourth chapter, we firstly design and assemble a laser heating device,the main equipment of the device is a helium-neon laser and a 3D printer, and debugging and familiar with the control software of heating device.And the change of the power of He Ne laser with the current is also tested. Subsequently,we start cleaning the glass substrate and etching out the ITO electrode of OLED.After being familiar with the principle of magnetron sputtering and coating equipment, the SiO2 insulating layer and the metal transition layer are successfully deposited on glass substrate and cover plate by magnetron sputtering.Then after several experiments, we successfully weld the indium and tin alloy layer on the metal transition layer of the glass base plate and the cove plate with electric soldering iron, prepared for the final laser encapsulating test.In order to ensure the uniformity and stability heated of the indium tin alloy layer during laser heating,designs and builds an 3D model based on the indium tin alloy layer as a prototype,which can be imported to the control software of 3D printer.Finally, use the Repetier-Host software to operate the laser heating device to complete the heating of the indium and tin alloy layer, which is welded on the glass base plate and the cove plate.