Thermal Field Analysis And Optimization Design Of Distributed High Power LED Component

High power LED, as a green light source, is used more and more widely inthe lighting field. It’s advantages are obvious, such as high energy savingefficiency, long service life and high security. Especially in recent years, it isaccepted by the public more widely, because of the strongly support and promoteto semiconductor lighting by the government. However, as a new kind of lightsource, the LED lighting is also asked to add more power to meet the marketdemand, in the preparation process of gradually replacing traditional light source.The heat dissipation, as an increasingly prominent issue, has became animportant factor restricting the development of high power LED. The analysisand study on the thermal field of the distributed power LED, as representative ofthe LED lighting surface light source, is particularly important. The distributedpower LED occupies an irreplaceable position in the LED market, due to itsflexible structure and lighting. And because of its unique structure, the thermalfield of it is more complicated then the common LED component. The heatdissipation problem needed to be solved urgently.The issue is to analysis the heat problem of distributed high power LED asthe breakthrough point. In order to improve the heat dissipation effectively. Bythe analysis and research on the heat field of distributed high-power LED lamp,the optimization of the whole structure of high power LED lamps, distributed toeach chip junction temperature, sending out a lot of heat generated by the LEDlight source chip quickly. Then, in order to improve the performance ofdistributed power LED lighting, we give the theory basis.This article analysis and overview the situation of the development of thedistributed power LED at home and abroad, put forward to optimize distributedhigh power LED component architecture to the homogenization temperature ofthe thermal field and enhance the heat dissipation. We analyze the root problem of the LED heat dissipation by the mathematics description. Then, making clearthe research content and research purpose. Putting forward the concept thatthermal coupling existing in the distributed high-power LED. Then, makingdetailed thermal analysis for chips, establishing a complete thermal model, andthrough theoretical analysis and comparison. Secondly, collecting the componenttemperature by measuring method using a thermocouple. Using orthogonalanalysis for main single heat dissipation performance analysis and research, tovarious factors that can affect the heat radiator distributed high power LED lamps.Respectively, a series of factors, such as the heat sink size, fin thickness, finheight, fin spacing and so on, and the LED chip junction temperature changes inrelation to draw curves. Clearly reflecting the influence of various factors on theLED chip junction temperature. Finally, by using the optimization results arethermal simulation of finite element simulation, lessened the proposedoptimization direction of thermal field of thermal coupling and more clearly toenhanced heat dissipation.