The Study Of Transfer Printing For The Microstructured Stamp In The Fabrication Of Micro-Nano Electronic Devices

with the miniaturization of the electronic device, the traditional preparation technology is difficult to meet the preparation requirements, and then transfer printing arises at the historic moment. Transfer printing is a kind of technique which orderly transfers different types of micro-nano materials from the source of growth substrate to the target substrate, and eventually assembles them to form functional devices. Transfer printing is mainly composed of two processes:transfer and printing. The key in transfer printing is how to transfer and printthe structure of the stamp successfully to the target substrate. In the process of transfer printing, the stamp, micro-nano material and substrate compose a model of sandwich structure, which includes two interfaces:stamp/micro-nano materials interface and micro-nano material/substrate interface. At present, the research of transfer printing mainly focuses on the fracture of the stamp/micro-nano materials interface, and the influence of micro-nano material/substrate interface is always ignored. Actually, in the process of transfer printing, the two interfaces compete fracture, and the order of fracture determines the failure or success of the transfer printing. However, the current research is mainly focused on the effect of the crack length, and the studies which synthetically consider the influence of the structure of stamp and separated films, and the velocity of stamp are absent. Based on the competing fracture of the two interfaces, the effect of velocity, the structure of the stamp, the shear load on the transfer printing of continuous film and separated films with array structure are studied in this thesis. The primary research contents and results are shown as follows:1. As to the model of sandwich structure in the transfer printing of continuous film, mechanics models are created, and reasonable laws are chosen to judge the success or failure of the transfer printing. Based on the interface energy release rate calculated by the finite element software, the effects of interface defects, film thickness and the material property of stamp on the transfer printing of continuous film are studied. The corresponding influence laws are given finally.2. The separated films with array structure are usually transferred by stamps with plate or post structures. The differences between the two kinds of stamps are discussed. The relationship between the space and height of the separated array structures and the structure of stamps are computed theoretically when roof collapse and lateral collapse happen. Besides, the influences of the space and height of the separated array structures, the size of the post structure of stamp and viscoelasticity of stamp material on the transfer printing are analyzed.3. When the microstructure on the surface of post structured stamp exists, the stamp/micro-nano materials interface is discontinuous. The90°peel theory is used to calculate the effect of line array microstructure on the energy release rate of the stamp/micro-nano materials interface. The effect of line array microstructure of the stamp surface on the stamp/micro-nano materials interface is analyzed. Then effect rule of the microstructure on the transfer printing is obtained.4. In the printing process, when moving the target substrate, and then pulling the stamp, the two interfaces stand the normal load and tangential load. The effect of displacement on the stamp/micro-nano materials interface and transfer printing is analyzed. At last, the displacement and microstructure of the stamp interface are considerated together to decide their effect on transfer printing.