Based On LED Research The Preparing Of Aluminum Copper Clad Laminate And Continuous Adhensive Film

Nowadays, LED electronic devices are a hot in science research.Withcontinuous improvement of LED luminous efficiency and drive current increasingsignificantly,thermal problem has become the biggest obstacle to the developmentof high power LED. Aluminum copper clad laminate has the better advantages ofgood electric insulation performance、 easy machining and heat conductingperformance,this paper chose the high power LED package as the research directionto get the target of industrial application and studied on several key technicalproblems on aluminum copper clad laminate applying in high power LEDpackaging by the surface pretreatment of aluminum and preparing continuousadhensive film.The main work and achievements of this paper are listed as follows:1、Analysising morphology and chemical thermal stability of domestic andforeign products,provide programmatical guidance and specific preparationprograms for the paper.2、Designing the Al2O3and AlN insulating layer from anodic and mafnetronsputtering on the aluminum plate.By comparing with the breakdown voltageperformance of the two films,we can find that the performance of AlN layer isbetter than Al2O3layer.Considered from the low-cost industrialization,thecomprehensive cost-effective of alumina insulating layer is better thanaluminumnitride than film layer.3、By mixing modified high-transmission of heat filling and epoxy resin toprepare a kind of continuous adhensive film.The different of fillers between beforeand after being modified are analyzed by FTIR、XPS、SEM;and the performanceof continuous film are analyzed by TG、 DSC and liquid nitrogen quenchingbreaking.Compared with domestic and foreign products，the continuous adhensivefilm has better excellent thermal conductivity and insulation properties in thealuminum copper clad laminate products.4、Having established the heat dissipating model of the aluminum CCL forhigh LED,and studied the influence of thermal conductivity the thermal resistanceof the aluminum CCL on the heat dispersion. Compared with thermal insulateadhesive with Al2O3fillers,the adhesive with AlN fillers can be improvedsignificantly.It is found that the content of AlN fillers increase to50%,whosethermal conductivity is up to1.74W/(m·K). But comprehensive analysis of theperformance of the thermal shock and peel strength, the content of the inorganicfiller in the continuous film is30%is best suited.