Study On Grinding Force Of Self-rotating Grinding Of Silicon

In the manufacture of integrated circuits(IC), monocrystalline silicon is the most commonly used as substrate. Monocrystalline silicon surface quality directly affects the performance and life of the components. With the rapid development of the IC, the increasingly high demand for monocrystalline silicon wafer surface quality and grinding accuracy. In the process of grinding, the grinding force directly affects the surface quality and grinding efficiency of the wafer. Studying the effect of grinding parameters on the grinding force can effectively analyze the factors affecting the grinding force, in order to better control the size of the grinding force and to improve the wafer surface quality and precision. Therefore, it is necessary to study grinding force and so on.On the basis of analyzing the principle of silicon self-rotating grinding, this thesis establishes a theoretical model of the static axial grinding force, according to the comprehensive analysis the data collected by grinding test. This thesis also studies the effect of grinding wheel grit size, grinding wheel axial feed speed and wheel speed on grinding force in the process of resin bond diamond wheel precision grinding, and uses the regression method to establish the empirical formula of the axial grinding force. At the same time, by detecting the monocrystalline silicon surface quality after grinding, this thesis establishes the relation between grinding parameters and wafer surface quality after grinding, and finally confirms the relationship between grinding parameters, grinding force and grinding surface quality.By a series of grinding test, this thesis concludes that the axial grinding force increases with increasing grinding wheel axial feed rate, but decreases with the increase of the grinding wheel speed, and the effect of the grinding wheel axial feed on grinding force is more significant, in the process of resin bond diamond wheel precision grinding of monocrystalline silicon. This thesis reaches a conclusion that the sizes of grinding wheel abrasive, grinding wheel binder, wear debris, and the surface effect of monocrystalline silicon has a great influence on the grinding force. When using the smaller size of the abrasive resin bond diamond grinding wheel, the grinding force decreases. The removal pattern of monocrystalline silicon is mainly brittle removal, when using600#resin bond diamond wheel precision grinding. When using600#resin bond diamond wheel precision grinding, the removal pattern of monocrystalline silicon is mainly plasticity removal.