PECVD Equipment Heating System Analysis And Optimization

In the field of photovoltaic, making Anti-Reflection Coating is an important process of preparation of polycrystalline silicon solar cells. As a component of solar cells Anti-Reflection Coating, silicon nitride thin films is prepared mainly through PECVD (plasma enhanced chemical vapor deposition) technology. In PECVD process, substrate temperature standards are very strict, because the uniform reaction temperature is necessary condition in the course of preparation uniform Anti-Reflection Coating film.This paper has discussed technology principle、process、process parameters of PECVD methods for preparing silicon nitride, funded the best process parameters of preparing high-quality silicon nitride. The experimental methods of the subject is measuring the temperature for typical points, namely, measuring the temperature on seven types points of the heater surface and the corresponding substrate holder surface by making use of thermocouples. Finally, we record the temperature data of the heater and the substrate holder surface, when the temperate of the substrate holder surface achieves stability.We make temperature field simulation for the Outside heating and inside heating large area flat-plate PECVD equipment chamber in the case of combining heat transfer theory and ANSYS finite element software. The simulation results close to experimental record of the Substrate holder surface temperature, this verify the correctness of the model and can guide the experimental heater temperature setting. We find that inside heating method can be achieved with a higher temperature of substrate holder surface. In addition, we have made the error analysis of the simulation value and experimental value and pointed out that it is caused the simulation deviate from the experimental values that the ideal assumptions before finite element simulation, the ideal heater model and measurement error.Finally, we base on the substrate holder surface temperature uniformity, aim at the heater power of the PECVD equipment and make optimized design by ANSYS software Secondary development module. This method is convenient and can replace the cumbersome manual test methods.