Development Of Thermal Analysis And Optimum Design Platform For Typical Heat Sink

With the integration and performance towards higher and the dimension towardsmore miniature，heat flow dissipated from electronic devices has been increasingcontinuously and has become one of the most restrictive factors hindering thedevelopment of electronic technology. Heat sink as the most use of heat flow devices,made the research of heat sink more and more. According to the complicated of thermalanalysis means for heat sink in our country at present, this paper developing theresearch of thermal analysis and optimum design technology for heat sink can shortenthe design periods, save the cost, improve quality. It is important to enhance thecapacity of heat sink structure design in theory and applications.Firstly, based on the commercial thermal analysis and optimization software, theplatform for thermal analysis and optimum design of heat sink was developed by usingC++Builder in this paper, the main function and hiberarchy of thermal analysis andoptimization was described, it also introduce the basic process of thermal analysis andoptimization and the technology structure of actualize for software and describes thekey technology to achieve this platform. Secondly, the thermal analysis and optimumdesign of typical rectangular fin heat sink are made by employing three differentoptimum methods: the theoretical formula based on thermal resistance、ICEPAKsoftware and optimization platform, after comparative analysis, it is concluded theoptimization platform is the best in accuracy and reliability. And then with respect torectangular and cylindrical pin fin heat sink under natural cooling condition, this paperanalyzes the factors affecting thermal performance of the heat sink from the fin height、fin number、thickness、ambient temperature. Finally, the thermal simulation andoptimum design of a complex electronic chassis are made. The numerical simulationshows that the fins structure parameters got by means of optimization platform optimizethe heat dissipation of the subassembly to achieve the thermal design requirements.