Uniformity Analysis Of Substrate Film Thickness Of Magnetron Sputtering Machine

Thickness uniformity of the substrate is an important factor with a measure of film quality and device performance, magnetron sputtering is one of the most common methods of film preparation, the study of thickness uniformity of magnetron sputtering technique has important instructed significance to production practicality. Base on how to gain fair film thickness uniformity from the large substrate, a small plane target is used in this thesis, according to the eccentric rotation mechanical structure, geometric model of thickness distribution in magnetron sputtering machine is established with a small plane target corresponding to a large substrate, deriving the integral formula of film thickness. In different parameters, computer simulation is proceeded for the film thickness distribution, providing a theoretical basis for the design of magnetron sputtering device.The results of Simulation experiment show that:when the eccentricity, etching region is fixed with eccentric rotation of the substrate, in a certain range, the film thickness uniformity of the substrate gets better with the increase of target distance H, whereas the film thickness reduces; When target distance, etching region is fixed, the film thickness of the substrate reduces with the increase of eccentricity e, the film thickness uniformity of the substrate gets worse before getting better; when the target distance, eccentricity is fixed, the size of etching region has significant effects on the film thickness, the film thickness increase significantly with the external diameter diameter of etching area increases, while the film thickness uniformity does not change significantly; the film thickness uniformity is effected by the speed ratio k of revolution and rotation with the complex motion of substrate revolution and rotation, when k increases, the thickness uniformity becomes better; at this time, the effect with target distance, eccentricity and the size of etching region on film thickness uniformity is consistent with eccentric rotation of the substrate.Simulation of two-dimensional curves and three-dimensional curved surfaces of film thickness distribution by MATLAB software, studying the effects of different parameters target distance, eccentricity, etching area size, substrate rotation and revolution speed ratio on the uniformity of film thickness. The optimal parameter values of thickness uniformity can be found, according to these parameter values, a part of the structure of magnetron sputtering device with meeting these parameters is studyed and designed. The last, datas obtained on the laboratory are analysed and managed and contrast to the results of theoretical analysis, drawing the consistent conclusions.