Analysis And Optimize The Gas System Of A Plane PECVD Equipment

In this paper, an analysis of a flat PECVD equipment systems, to find cases in the low-pressure simulation using FLUENT software gas field method to simulate the response of the discharge chamber pressure and velocity field. Analysis of the structure of the fabric of different gas pressure on the gas field uniformity; and contrast of the reference point of the set pressure of the gas field to the gas cloth sieve analysis to improve the structure so that the reference point of the pressure distribution to be improved to enhance the thickness uniformity of purpose.Using FLUENT software Gambit pre-processing software instrument of sky technology development of the gas PECVD equipment described structure, in order to improve the calculation of the efficiency of gas into the structure of non-uniform grid, and in papers focused on the needs of the site---and gas field under the plate near the air intake near the screen even with high accuracy hexahedron mesh into a dense, and in other non-key parts of a cut-based grids in order to enhance simulation speed.Thesis calculated the discrimination parameters viscous flow through the paper calculated the experimental equipment used in PECVD gas market can be regarded as a continuous viscous flow, finite element method can be used for computer simulation. Papers identified in the FLUENT software simulation needs:pressure velocity coupling method using SIMPLE method, the use of standard methods of discrete pressure, the first order discrete momentum wind model, the use of steady-state separation implicit method, the model for three-dimensional structure, the reaction gas The velocity field used to calculate the absolute speed.Optimization of the gas field was found:in the exhaust port baffle effect of the installation of Office is not very clear, and in the inlet and after the installation of four-way nozzle chamber to change the height of the discharge reaction can significantly increase the pressure field and velocity field distribution change the reaction chamber of a high discharge pressure field and velocity field as well. Will respond to the way the exhaust discharge chamber changed from both sides of the exhaust ventilation at the bottom center, the pressure field becomes more uniform, more consistent flow of air to achieve optimized results. In the neglect of other conditions, the distribution of film thickness from the table and the corresponding pressure distribution can be seen, the distribution of film thickness and gas field is closely related to the distribution of good and bad.