Research About The Thermal Simulation And Infrared Temperature Measurement Of Satellite Instruments

Defects of thermal design in a instrument can generally be found until the instrument is already produced and in its debugging stage. Otherwise a lot of money and time will be wasted for redesign. On the other hand, the latent high temperature induced unreliability of high power devices can not be found due to the lack of detailed instrument thermal analysis.When finite element analysis software is used to analyse instrument thermal design in space technology, boundary condition is always set to vacuum environment and convection is infrequently considered. While in the debugging process of instruments usually goes along at atmosphere environment, it is very necessary to analyse instrument thermal state with consideration of convection at atmosphere environment. In this paper, a representative instrument which appeared in a developing satellite was chosen as the subject investigated. The finite element analysis software-TMG was used to calculate thermal state of the instrument with boundary condition set to atmosphere environment. The results were compared with testing datum coming from a experimentation in which thermocouple or Infrared imaging sensor was used to measure temperature field. Finally, the temperature of devices in the instrument was calculated in vacuum environment with the corrected model.Experience on instrument thermal analysis which has a direction meaning for future work was accumulated through the thermal state calculation of a solid memory machine and a TR module with the help of TMG thermal analysis software, which was ulteriorly understood especially for the appearance of convection in boundary condition. At the same time, correlative experience on infrared temperature measurement technology was also accumulated.In this paper, technique study on infrared temperature measurement was also contained, including the analyse about error and the relation between the results by Infrared imaging sensor and the emissivity. Experience through infrared temperature measurement of a solid memory machine and a TR module was accumulated.