Porous Silicon-based Thermal Components

With the development of Micro-Electro-Mechanical System (MEMS) technology, porous silicon has become a new kind of sacrificial or thermal isolation materials used in MEMS due to its excellent mechanical and thermal isolation properties. Thermal sensors always hold an important status in the industry and agriculture manufacture and also in the everyday living. A new type of the thermal sensor with the structure of thermopile based on the porous silicon is designed and studied in this paper. We prepare the porous silicon accordant with our requirement and study its elementary characteristics and thermal isolation performance. The work principle of sensor is presented theoretically. The structure of thermopile, the photolithographic mask and the measurement and control circuit system is designed. Using the IntelliSuite software, the technological flow is simulated and get what we have designed. And using it the three-dimensional modeling of the thermopile is done and subsequently we do the heat and stress analysis to it. At the same time, using ANSYS finite element analysis software, thermoelectrical performance simulation of the thermocouple and heat exchange ability of the porous silicon is simulated. It is proved that the technology method is feasible to manufacture the thermal sensor with the structure of thermopile by using the MEMS technology. Furthermore, intellectualized thermal measurement and control circuit system based on Single Chip Micyoco (SCM) is designed, which accordingly provide possibility for the realization of the System on Chip (SOC).