The Receiver Front-end Research, Based On Ltcc Mcm

Low-Temperature Co-fired Ceramic (LTCC) technology is one type of Co-fired ceramic multi-chip module (MCM-C), which is a high-integration and multilayer- printed packaging technology. Its three-dimension (2D) structure brings a bran-new design conception and methods into the domain of traditional microwave and millimeter-wave circuits & systems. The focus of paper is that, based on LTCC packaging technology, integrate the transceiver front end into the LTCC multilayer substrate. This is an important step in the process of realizing compact, high-performance and low-cost millimeter-wave modules.Such contents involved in this dissertation are as following:1. Characteristic, current developments and trends of MCM and LTCC are systemically introduced. The reasons and content of this paper are also introduced.2. Buried inductors and capacitors basing on LTCC technology are introduced particularly.general process flow and design method is investigated. We also discuss the impact of different parameters on these components.3. The research focus of this paper is to design and fabricate a few kinds of passive components including power divider, balun and LC bandpass filter using LTCC technology with vertical interconnecting on multiplayer. By using by the electromagnetic field analysis software to simulate and optimize, we gain a finer result. The proposed passive components have a flexible structure and can be modified according to the technical condition.4. Combining LTCC technology with the design target, using the proposed LC bandpass filter, circuit layout and bias circuit are dissertated, and we demonstrate the feasibility from the point of theory. Result from these, the S band (multichip modules) front-end is successfully designed.