| A high performance epoxy composition for encapsulating light emitting diode (LED) was prepared by selecting low molecular weight epoxy resin, anhydride curing agent, accelerators and other assistants, by the mean time controlling the concentration of dissociating chlorine of epoxy resin, resin color and purity of anhydride.An active diluents was used to decrease the viscosity and curing stress and to enhance the crack resistance of the cured resin without damaging activity and the composition can be used for the large electronic encapsulating. A system of epoxy resin , anhydride and accelerator was selected which efficiently promoting the curing speed and decreasing curing temperature. Thus, a epoxy component for encap.sulating LED gives rise to excellent yellow-resistance and good transparent appearances.An inner mold-releasing agent was prepared from modified silicone oil, which showing excellent dissolution, good mold releasability and good light transmission while applied into encapsulating component CG-8071.In this paper the research work was enlarged to 2000t/a manufacture scale, a larger market place and lowerproduction cost are expected.A training guide book was written for the operating workers training. The project has now successfully been running. |
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