The Development Of High Dielectric Constant Of The Electrical Properties Of Epoxy Copper Clad Laminates

It is an important direction to study copper-clad plate in modified epoxy with high dielectric property in the paper. Firstly this paper expounds dielectric property and some factors effecting it in theory, analyzing and comparing and devising resin matrix of modified epoxy copper-clad plate and the choice of reinforced materials while to improve dielectric property being seen as a central aim in laminate plate's design of function for the first time. In this way, laminated molding is concerned as processing method in manufacturing that kind of copper-clad plate and the primary components is that modified epoxy matrix includes EX27-D and F51 and MPPO and'so on, and that EW190s glass fiber without alkali is chosen as reinforced material. And then the curing method of modified epoxy is theoretically proven by some techniques such as viscosity and gel time and DSC and so on. After this, the laminates processing method of modified epoxy copper-clad plate with high dielectric property is finally fixed by experiments on laminate time after time and results of testing produced laminate. The study shows that produced laminate, according to the optimal processing method, non-dielectric properties meets requirement and owns high dielectric properties, ?=3.7 and tan 8 =0.0104.