Analytical And Simulation Study On Thermal Contact Resistance Of Solid Interfaces At Low Temperature

Thermal transport of solid interfaces is a frontier of micro-scale heat transfer,and also a key scientific problem in applied superconductivity, special thermal control, and heat dissipation of microelectronic systems and nano-devices. This thesis focuses on thermal contact resistance of solid interfaces, does research work to explore its microcosmic mechanism with regression analysis, model simulation, theoretical analysis method.Based on our former experimental studies, laser photo-thermal experimental mechanism and its application conditions are further studied, laser photo-thermal experimental system and equipments for cooper- aluminum nitride thermal contact resistance are designed.Based on related experimental data, regression analysis and model simulation on the thermal contact resistances of copper-stainless steel, cooper-aluminum, cooper-cooper interfaces is made. It is found that with the increase of temperature, they drop rapidly at first and then slowly ascend; they also decrease when the pressure increases. Investigation also showed that coupling between temperature and pressure exists and contributes to thermal contact resistance of solid interfaces.On the basics of 3D micro-structure contact interface layer concept, solid-solid thermal contact resistance models of phonon transport are discussed and analyzed. Take phonon transport, electron transport and electron-phonon coupling into consideration, thermal contact resistance models of hot carrier is built in this paper.Owing to the complexity and uncertainty of solid-solid thermal contact resistance, revelation and clarify of thermal transport characteristic and mechanism of solid interfaces needs deeper study urgently.