Preparation And Properties Of New Silicone Potting Material

With the development of aerospace and electric industry, high performance has been demanded more and more to the organicsilicon encapsulating material. It is the impotant research topic in the field that exploring new method of preparing organicsilicon encapsulating materials and finding effective approach to improve the applying performance. This paper mainly analyses the relevant performance and discusses the microstructure of the material which is modified by the filler, at the same time, the applying of plasma in the preparing is investigated in the paper.Through the method of high-speed dispersion, the encapsulating material has been prepared by different modified system. The results of testing show that the material modified by nano-SiO₂ has the maxium of tensile strengthen: 0.81MPa, and its elongation is 95%. The value of tensile strength of the other two materials -attapulgite/organosilicon material and silica-gel/organosilicon material are 0.73MPa and 0.71MPa respectively, the elongation value are all 100%;The heat-resistant temperature of the three encapsulating materials have been improved greatly. The SEM and the TEM analyses show that the fillers are well dispersed in the matrix, the bonding force of the interface between fillers and matrix were greatly improved which are benefit for the transfer of the stress and lead to the better macroscopical mechanical property of the materials.The paper also researches the application of feasibility of plasma technology in the material preparation. Through this technology, the nano-SiO₂/organosilicon material and the attapulgite/organosilicon material have been prepared. The properties of the material has been tested. The result shows that the tensile strength of nano-SiO₂/organosilicon material has reached to 0.98MPa when the content of the nanoparticle is about 3%, and attapulgite/organosilicon material is 0.91MPa when the content of the attapulgite is 15%, the repective elongation is 110% and 135% . The heat-resistant temperature of latter is increased.The microstructure of the material also has been analysed by the method of transmission electron microscopy, scanning electron microscopy and differential scanning calorimetry, ete. The results explain that the filler has the well compatibilityand diffraction in the matrix.