Study On SiC/Cu Electronic Packing Materials Made Through High Velocity Flame Spraying Technique

The surface reform treatment of SiC podwer was carried out by electroless plating, the attractive SiC/Cu electronic package material was sucfully fabricated by a high velocity flame spraying. The relationship between deposite quality and pretreatment and plating technology were discussed, and influences of spraying technique and hot pressing on the microstructures of SiC/Cu composite were investigated, the mechanisms of SiC volume fraction and hot pressing on the coefficients of thermal expansion and thermal conductivity were stated. The optimise technolgies of chemical plating and deposite and hot pressing were determined. The research laids a good foundation for new kind electronic package materials and products to the market.The results showed that the sensiting treatment is the key section during electroless plating. The sentized solution has influenced the depositing coating quality. The good and low cost coatings are also obtained after the expensive PaCl2 activating agent has been substituted for AgNO3. The optimized copper coatings of SiC particles are uniform and dense, no naked SiC particles if the compositions of electroless plating solution are chosen and conditions for chemical plating are controlled.The results further showed that the wettability between SiC ceramics and Cu are improved, the high volume fraction and low porosity can be gained under the compressed air pressure and acetylene pressure and spraying distance. SiC and Cu phases are main ones in the SiC/Cu specimen, along with tiny copper oxidation.The hot pressing results proved that the density of SiC/Cu specimen increases gradully and reaches a stable value finally with temperature and pressure of hot pressing; the porosity increases with loading rate. The interface of SiC/Cu materials bonds well after hot press are conducted.The thermal physical porperties results showed that the coefficients of thermal expansion of SiC/Cu electronic package materials increases with tempweature increasing; the coefficients of thermal expansion and thermal conductivity decreases with SiC volume fraction. The coefficients of thermal expansion falls and thermal conductivity rises after hot pressiing.Many tests proved that the 52%vol SiC/Cu electronic package materials with good property can be obtained. Compared to other electronic package materials, the material can fully reach the goal of electronic package materials.