Technology Research On Yield Estimation And Promotion

This paper aims at discussing the prediction of yield of integrated circuits and upgrading technology in detail. The results are as follows:First, the formation of various defects, circuit faults and the model of size distribution are analyzed. The models which are used for yield prediction and the concepts of critical area, the basic and improved calculation model of open and short circuit critical area are also introduced. At the basis of the above knowledge critical area calculation by considering fault distribution is raisedAnd then, the extraction algorithm of the optimized position of layout-wiring is proposed and realized. The defects having the characteristics of space, shape and size distribution, according to the distribution of the characteristics of these defects optimizing design of layout-wiring is a new research direction to enhance yield . In this paper, considering the size distribution of defects and binding the distribution of defects under nanometer-manufacturing technology, the extraction algorithm of the optimized position of layout-wiring based on open circuit and short-circuit critical area is designed and implemented. The spatial distribution and size distribution probability of defects is given by the algorithm. According to the probability the open circuit and short-circuit critical area of different line network is calculated and then with the critical area the position information to optimize line network is proposed.Then layout is optimized by adjusting layout-wiring needing to be optimized and the minimum critical area can be calculated by linear programming. By MATLAB programming the layout-wiring is optimized.Finally a yield estimation software is developed by the use of MATLAB and thesoftware is integrated and released to enhance the versatility of the software.The research result is important to yield prediction and upgrading and will play an important role in the practicability of yield prediction and upgrading.