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The Design And Implementation Of A Solder Paste Inspection System Based On Image Module Array

Posted on:2009-11-18Degree:MasterType:Thesis
Country:ChinaCandidate:Y WangFull Text:PDF
GTID:2178360275971684Subject:Software engineering
Abstract/Summary:PDF Full Text Request
Printed circuit boards and electronic components are become more and more integrated and micromation. Tranditional auto optical inspection system became hard to meet the high speed and high precise requirements.Auto optical inspection system based on image module array using many modules working together to shorter inspect time and improve precision. Research based on such system has begun.To solve problems on tranditional solder paste inspection system, auto optical inspect system based on image module divided solder paste inspection into two-level process.The first level process is finished by image module, and inspection system fetch back result from image modules and finish the second level process.Using this two-level process can solve speed and precise problems on tranditional solder paste inspection system.System could be divided into two function parts: inpsection data generate system and auto inspects flow system.Inspection data generate system has designed a precision control module to solve precision problems in image module array.Auto inspects flow system has designed two-level process logic to solve speed and precision problems.For display 3D solder paste, SPI system also designed a arithmetic to build 3D module of solder paste from image data.The SPI system is well designed and have tested on SMT line.It has meet the requirement of SMT line, improved AOI based image module array is a viable solution to improve AOI's inspection ability.
Keywords/Search Tags:Automated optical inspection, Printed circuit board, Solder paste inspection, Image module array
PDF Full Text Request
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