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The Optical Simulation Of Multi-chip LED

Posted on:2008-02-29Degree:MasterType:Thesis
Country:ChinaCandidate:Z P CengFull Text:PDF
GTID:2178360272467789Subject:Digital material forming
Abstract/Summary:PDF Full Text Request
With the development of LED chip and LED packaging technology, complying with the demand for the high luminous flux LED products of lighting field, the multi-chip chip LED packages have been enter into the market progressively. But if such LED packages will really enter the lighting field, the designs of its optics and thermal must be considered. The candela distribution and the view angle will be measured after the products have been manufactured in traditional optics systems of LED packaging. If the data can't reach the request, we should change the structure or materials of packaging. This text we use the optics software Tracepro to carry on simulation for the power multi-chip LED packages, and the candela distribution and the view angle can be analysed by the simulation result. Thus we can improve the efficiency of the multi-chip LED's optical system design and save the development cost .First the high-power LED of single chip have been simulated, the results indicates the simple model which replaces the complicated LED can be match with our requirement within the range of certain error, and the real candela distribution can be reflected very well. This proves that it has been provided a good method for the optics system design of LED packaging and the predicts of LED's candela distribution.It has an extensive application in general lighting and backlight source products using RGB chip to mix power white light LED. In order to make the mixed white light of RGB LED very well, the luminous flux have been calculated based on the principle of colourometry and optics, and the best position of the chip arranges have been got after the optical simulation using Tracepro.A kind of high-power 8 chips LED have been designed, and the optical simulation using Tracepro have been carried on. Whitout changing the light output and the position of the chip, the relationship between the height of the lens and the candela distribution, the view angle and the efficiency of light output is obtained only by adjusting the height of the lens.
Keywords/Search Tags:LED packaging, Optical simulation, Multi-chip LED, Tracepro
PDF Full Text Request
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