The Research Of Transfer Pattern Layer And Stamp Imprinting And Curing Process Based On UV-NIL

Nano-structure is the basic research of nanotechnology. Along with the decrease of integrated circuit's critical dimension, conventional projection lithography is facing the problem of cost and technology, becoming one of difficult science research problems to be solved in the world .Conventional theory may no longer apply and new phenomena emerge, nanoimprint. It has the advantage over conventional nanofabrication methods, high resolution, low cost and high throughput, suitable for industrial production. It can make sub-100nm width structure; it can be applied in IC fabrication, MEMS, bios-sensor and optical device. The research was supported as a 2005 key research project by Science & Technology Commission of Shanghai Municipality.Although nanoimprint has great advantage and prospect application, the process of nanoimprint and its operation object extremely precise. Therefore each step of technological process has the approximate strict request to the equipment and the operation, the technical content is very high, also this new technical itself still was in the development earlier period, many technical difficult problem should be solved, such as stamp design and fabrication; establish the model to control the thickness and uniformity of transfer layer; According to liquid flow and UV-cure theory, study about transfer pattern process and stamp imprinting and curing process.In the paper, different nanoimprint techniques are described. All these techniques are classified according to their process and principle. Their advantages and disadvantages are shown. This paper is focused on UV-NIL, which is the most reprehensive foreground technique. It is discussed about UV-NIL key technique: transfer pattern process; stamp imprinting and curing process. Based on hydrodynamics theory, the paper builds the mathematical model of spin coating equipment to control the thickness and uniformity of transfer pattern layer. According to the stamp feature pattern structure, design the best thickness of transfer pattern layer, establish the relationship between the residual layer, transfer pattern layer and...