Failure Analysis Application In Advanced Semiconductor Process

Semiconductor technology is entering new generation, Some advantaged company had developed 32nm technology, and new 32nm low power and high performance production will apply on computer, cell phone and consumable electro-production. New failure analytic technologies and instruments are developed and applied to the field of failure analysis for electronic components, FA can improve line yield ,get failed sample root cause.This paper demonstrated the application and theory of semiconductor process and instrument, In the second chapter, new failure analysis instrument and technology had been introduced, such as SEM (Scanning Electron Microscopy), FIB (Focus Ion Beam) etc.In the Third chapter, new semiconductor process and new FA technology had been introduced,. From author FA experience, this paper introduces some typical events in Semiconductor. Search reason, course, and find the root cause with process engineer, Equipment engineer and device engineer. Build FA mechanism, prevent the same case. Got the final solution.