Research On Encapsulating Technology For Electronic Devices And Development Of Mixing Pouring And Dispensing Machine Of Two Different Glues

This subject is a RD project which is on the basis of the market-oriented requests for electrical components embedment. It calls us to ensure the system's technical target reach to the same level as well as congener products abroad. Therefore, the design of a feasible structure conforms to the integrate principle of mechanism, electronics, pneumatology and rheology, and a new-type mixing pouring and dispensing machine of the two different glues is developed successfully.It is primarily introduced the hardware composition and workflow of the machine, especially at the measuring and mixing system, detailed at the operating principle of gas and glues. Moreover, the selection of various components and the construction of the inner machine are discussed in this paper.The key technology and reliability of the machine design are also studied in this paper, which includes the measuring system with adjustable proportion, the pump clearance of sealing without leakage, the static mixed system named SK model with the ability to be paused and cleaned wholly self-propelled and so on.According to the customer feedback, the system reached the expected technical index, with perfect performance and stable operation. Meanwhile, its cost-performance ratio is also according with the actual situation in internal electronics industry. Summing up the above, the equipment is provided with high market potential and application value, can acquire favorable social value and economic benefits.