Study Of Technology Of Water-Cool In The Computer

Heat generation of CPU becomes larger and larger because of the rapid development of computer technology. It is key problem for solving heat removal of CPU and developing an efficient cooling technology. For the time being, the most useful and the most extensively used cooling method of CPU is still the forced convection. Heat sinks are used to remove the heat of personal computers. For designer and user of heat sink, it is very necessary to grasp the knowledge about characteristics of heat dispersing. Since its intensive heat transfer characteristics, heat pipe behaves a profound advantage in the cooling of CPU. There are five chapters. At first the background and significance of the work are brief introduced, as well as the history in this field. In chapter 2,we introduce heat pipe and its running principle,characteristic,sort,theory and heat transfer limit. The heat transfer characteristics of thermosyphon, gravitation heat pipe, is introduced in tails. Based on this theory, a heat sink with heat pipe is fabricated. In the chapter 3, the popular FEA soft (ANSYS) is briefly introduced, then some basic conceptions are explained farther.The ordinarily heat siank and heat sink with heat pipe are emulated by using ANSYS, and we analyze the distributions of the temperature and the the temperature that the CPU creates. These approaches are of fundamental to the design and fabrication of the electromagnetic micro relay in the future.These approaches are of fundamental to the design and fabrication of the heat sink with heat pipe in the future. In the chapter 4, the mainly aims at the study of thermal characteristic of heat sink with heat pipe under natural and forced convection. Heat transfer is depend on the phase change of work fluid in the heat pipe. Since, the performance of work fluid is very important for heat transfer of heat pipe. The performance of thermosyphon is greatly affected by the filling amount. The work fluid filling amount in the thermosyphon is studied, and the optimal work fluid and filling amount are presented by means of the experimental study. In the chapter 5, Based on the MEMS technology, a method of fabrication of micro EHD pump is presented. All of research results indicated that heat sink with heat pipe for CPU can completely meet the thermal dispersion request .