Study On The Off-chip Tensile Test Experimental Facility For Micro-component Mechanical Property

With the development of MEMS, people inevitably encounter a lot of mechanical problems in product design, processing, packaging, performance and reliability testing. Moreover, the mechanical properties based on MEMS technology has fallen far behind the electrical properties of materials and processing technology in the research. The main reason is that the mechanical properties of materials researching method has no uniform standards, measurement accuracy is vastly different, so the measured data has great dispersion. Thus contribute the mechanical properties research of MEMS to become a hot spot.Currently, elastic modulus, residual stress, tensile strength and fatigue testing is the most important characteristics of the measurement target of micro-mechanical components. A variety of testing methods ware made to measure these mechanical quantity, such as nanoindentation, tympanic membrane, bending, stretching and reverse. In this testing methods, the main function of tensile test in mechanical property testing of micro-sized structure is testing elastic ratio, Poisson's ratio, yield strength and fracture strength. Doing uniaxial tensile testing, materials subjected to uniform tensile stress. So the testing results can reflect the strength and fatigue behavior of thin film materials more comprehensively. Moreover, the measured data can be explained easily. On the basis of summing up the work of predecessors, this paper presents a design procedure and principle of an off-chip tensile test experimental facility which can measure 100um-1mm length and 1um-10um thickness scope of the film. The facility includes piezoelectric actuator, displacement sensor, force sensor, dynamic and static loading platform, precision positioning stage, image acquisition. A piezoelectric ceramic package and clamping structure was designed specially. The functions of each part are explained separately. Specimen is placed on the dynamic and static platform, piezoelectric actuator drive dynamic platform to pull specimen till specimen is snapped. The force loaded on the specimen and the elongation of it are measured by the displacement sensor and the force sensor respectively. Meanwhile, real-time image viewing device can observe specimen surface and its changes. Using Lab VIEW graphical programming language to compile data acquisition software for displacement sensors, force sensor and image acquisition software for image acquisition device was also compiled. Force resolution is up to 8uN, displacement resolution is up to 7.6nm, image resolution is up to 0.3um. Displacement-voltage of the displacement sensor, delayed, creep and nonlinear properties of the piezoelectric actuator and...