The 3D Temperature Field Analysis Of Solid State Relay

With the rapid development of electronic industry, the application of the electronic components becomes more and more wide。 When design electronic products, particularly in the aerospace craft, the properties of high density and small volume must be considered。The disable rate of these components increases exponentially with the rise of the temperature, the higher the temperature, the less the reliability, so the reliability of these equipments is affected directly。 In view of the above, it is essential to study the temperature distribution of these electronic components。As a kind of electronic component, solid state relay (SSR )works at the extreme aerospace condition, so the thermal analysis problem appears very important, at the same time the thermal scatter has being a main factor restricting the further development of the solid state relay。 Traditional method of thermal analysis uses " circuit" to calculate the distribution of temperature, and improves it by reducing the thermal resistance, but this method will lead to relatively large errors 。With the development of the finite element technology, now we introduce the finite element method ( FEM ), by which we can analyze the 3D thermal condition of an SSR, and improve the accuracy of the resultoThis article illustrates the 3D temperature field analysis of an solid state relay by the finite element analysis software ANSYS, including steady state and transient analysis, then compares the finite element analysis results with the results of experiment。 The ANSYS analysis results are in the allowable error range of engineering, the reasons of the difference are inaccurate experiment conditions, the error of measurement and engineering calculation, and so on。 At the same time, in order to suit the designers, this article combines VC and APDL to make the analytic process automatic ,flexible and efficient。...