Experimental Testing Of CPU Thermal Column Radiator And Numerical Simulation Of Its Flow Field And Temperature Field

With the rapid development of electronic technology, the use of computer is becoming more popular now, everyone's daily life and work increasingly closely linked with the computer, while set higher requirements on the computer's stability, usability, integration and other aspects, This makes the integration of CPU chip improve constantly,a single chip power is also increasing, heat is in alarming rise . CPU's operating temperature is directly related to the computer's stability and service life. High temperature will speed the computer down and sometimes the computer will crash or chip burning, etc. It is very urgent to solve the CPU heat problem. It is one effective way to use of the high performance CPU cooling radiator to reduce the CPU temperature.This article studied a unique radial thermal column radiator, which has already used in the market. In order to analysis of the heat dissipation, we make experimental studies on the radiator and simulation on the flow field and temperature field. Meanwhile, this proposes valuable advice for CPU radiator thermal design.Firstly, the working principle and characteristics of the thermal column were analyzed,compared to conventional solid copper pillar radiator,thermal column radiator has the existence of advantages. And we derive the total thermal column radiator heat transfer model; find the key factors affecting the heat transfer. At the same time, the experimental device is manufactured which is used to test thermal column radiator and study its performance under different operating conditions. According to the results of tests, the whole plume temperature distribution and the cooling performance curve of radiator at different wind speeds and different power were obtained, the change of power and speed influence the surface temperature of hot chips were summarized.FLUENT software is used to simulate the flow field and temperature field of the radiator on different conditions. The radiator flow and temperature distribution and the details of flow and heat transfer were obtained. And simulation results are compared with experimental results to verify the feasibility of the experimental apparatus and the reliability of FLUENT software in the CPU heat sink thermal design. The results show that compared with the same size copper pillar radiator, the thermal column radiator can drop the temperature of CPU lower, and has a good soaking effect on the CPU heat source. The thermal column radiator not only can spread the heat throughout the radiator more quickly, and the heat is distributed in a larger area more evenly, which play the role of each of the cooling fins fully. So this radiator can satisfy the cooling needs of CPU chips at low wind speed, and also solve the noise problems effectively which high speed fan bring.