Study Of The Deposition And Properties Of CrN_x And Cu Films By High Power Pulsed Unbalanced Magnetron Sputtering

As a new technology providing high ionization rate of sputtering materials and high the plasma density, High power pulsed magnetron sputtering (HPPMS) technology is able to deposit dense films with high performance, it has been extensively studied in foreign countries, but it has seldom been reported in China. Therefore it is important significance to research HPPMS. In the paper, high-power pulsed unbalanced magnetron sputtering (HPPUMS) technology was used to deposited CrNx films and Cu films, and the relationship between the parameters of HPPUMS technical and sediment characteristics were studied.In the third chapter, CrNx films were deposited by high-power pulsed unbalanced magnetron sputtering (HPPUMS) technology, and compared with CrNx films deposited by mid-frequency magnetron sputtering (MFMS) under the same conditions. The results showed that CrNx films deposited by HPPUMS have better overall performance:higher hardness, higher strength and lower friction coefficient than CrNx films deposited by MFMS. The CrNx films composed with two phases of CrN and Cr2N. The pulse voltage and the pulse current of HPPUMS discharge with Cr target were diagnosed, the results showed that work pressure and reactive gas N2 can influence the pulse voltage, the pulse current and pulse frequency of HPPUMS discharge, respectively.In the Fourth chapter, high-power pulsed unbalanced magnetron sputtering (HPPUMS) was used to deposited Cu film. It can be seen that the deposition parameters have significant impact on deposition rate of Cu films, such as work pressure, substrate bias voltage,the excitation current, and so on. In the paper, the exciting coil was used to improve the shortcomings of low deposition rate of HPPMS, and make deposition rate of Cu films increasing to 55.29%.The ionization rate of Cu target can reach up to 28.37% and the plasma density can be achieved 1019/m3.