Durability of polymer/metal interfaces under cyclic loading

Fatigue crack growth along metal/epoxy interface was examined in an aqueous environment and under mixed-mode conditions. A stress corrosion cracking mechanism was identified in this process. The fatigue crack growth rate in an aqueous environment was increased by several orders of magnitude and the fatigue threshold decreased by a factor of 10. The loss of adhesion in the aqueous environment was induced by the hydration of the surface oxide which resulted in a hydroxide with poor adhesion to the substrate metal. Self-assembled monolayer of long chain alkyl phosphonic acid and amino phosphonic acid were synthesized to enhance the adhesion and improve the durability of Al/epoxy interfacial bonding system. The same approach was taken to promote adhesion between copper and epoxy, where a two-component coupling system of 11-mercapto-1-undercanol and 3-aminopropyltriethoxysilane provided the most significant improvement in the copper/epoxy adhesion.; The mixed-mode was applied by a piezoelectric actuator. Subcritical crack growth was observed along the epoxy/aluminum interface and the growth rate was found to depend on the magnitude of the applied electric field. Kinetics of the crack growth was correlated with the piezoelectric driving force. The resulting crack growth behavior was compared with the results from the conventional mechanical testing technique. Large differences were found between these two methods. Using this newly developed technique, effects of loading mode and frequency were studied. The fatigue resistance was found to increase with the mode II component and was expressed as a function of the K_II/K _I ratio. A strong frequency effect was observed for the subcritical crack growth along the Al/Epoxy interface, their fatigue resistance increased with the testing frequency.