| Poly-crystalline diamond (poly-C), with unique mechanical, thermal, chemical and electrical properties, is an excellent material for MicroElectroMechanicalSystems (MEMS) and its packaging applications. The research reported in this dissertation focuses on the investigation of applications of CVD poly-C technology in the area of MEMS packaging.;MEMS design is quite application-specific. Therefore, it is important to couple the packaging design closely with MEMS design. Tremendous research efforts have been exerted on the studies of various packaging technologies, which can be classified as wafer bonding process, encapsulation process and 3-D multi-chip-module assembly. In addition to improve conventional MEMS packaging technologies, there is also a growing interest to explore the applications of new material technologies on MEMS packaging. Recently, poly-C has emerged as a novel material for MEMS applications on both micro device and packaging.;In this research work, fundamental researches on poly-C thin film techniques, such as seeding, CVD deposition and doping, have been performed for the purpose of characterization and improvement. Then, several enabling techniques have been developed, including poly-C microstructure fabrication, ultra-fast diamond growth model, poly-C panel with built-in interconnects and diamond-diamond CVD bonding. Based on all these techniques, a poly-C thin film encapsulation packaging process which can be intenerated with MEMS device fabrication process has been developed.;This poly-C thin film packaging technology has been used to encapsulate poly-C cantilever resonator, to evaluate the efficacy of poly-C encapsulation. Poly-C cantilever beam resonators were tested using piezoelectric actuation and laser detection method before and after poly-C packaging process. Resonance frequencies measured before and after are in the range of 240-320 KHz, which is consistent with theoretical calculations. The application of diamond for thin film package is being reported for the first time. |
