Researches On Thermal Reliability And Relative Equipment Of Electronic Component

Reliability tests were key sections after the manufacture of electric products, and environmental chamber was the most popular used equipment in the reliability test. After packaging of electric products, reliability problem was the most concern of many people. The quality of soldering in reflow oven could affect the reliability of electric products. Research and development of new reflow ovens and environmental chambers had a great promotion for reflow soldering and reliability test of electronic components. At present, with the increase of the power density, electronic packaging exists the problem which heat dissipation of electronic products was not good; the reliability test exists the problem which the reliability assignment was so many and the test effect was not good; environment chamber exists the problem which the function of chamber was too simple to conduct many other environmental tests, and it can't meet the special requirements of environmental tests; small reflow oven exists the problem which can't soldering in batch mode, by pipelining and by fast cooling in the soldering process. What's more, temperature uniformity of the environmental chamber and reflow oven will affect the effect of the reliability test and reflow soldering.According to these problems mentioned above, packaging and cooling, reliability test, reflow soldering equipment and reliability equipment were studied by the methods of the designs, simulations and tests. In terms of design, two new types of water cooling micro-channel heat sink were devised for IGBT modules, and three new different reflow ovens and a multi-functional environmental chamber were devised. A special high temperature chamber and a low temperature chamber were designed. In the simulation aspect, thermal performance of LED in the environmental chamber was simulated, and temperature field and flow field were also simulated in the high temperature chamber and thermal cycling chamber, then temperature uniformity was analyzed. As for the tests, LED reliability tests were conducted. Temperature distribution and temperature uniformity were tested in high temperature chamber, low temperature chamber and thermal cycling chamber, and temperature uniformity was focused on. Work and innovations of the paper were as follow:1) The packaging processes and thermal performance of LED and IGBT were investigated. Two new types of water cooling micro-channel heat sink were devised for IGBT modules. Thermal shock tests of LED with electricity and without electricity were conducted. The luminous flux of LED was tested in the experiments. At the same time, virtual reliability of LED was simulated in high temperature and low temperature, and stress distribution and deformation situation were analyzed. Some calculated methods of LED lifetime were found out.2) Thermal shock chamber and fast thermal cycling chamber were investigated, and a multi-functional environmental chamber was devised. A special high temperature chamber and a low temperature chamber were devised according to the special situation. Liquid nitrogen cooling and thermoelectric cooling were used in the low temperature chamber.3) Reflow soldering process in nitrogen atmosphere and soldering under different reflow temperature curves were conducted experimental investigated, and the rotary reflow oven, the liquid nitrogen cooling reflow oven and the contact heat transfer reflow oven were proposed out.4) Several primary influencing factors of temperature uniformity were found out. The effects of opening and closing door of chamber, samples size, fixture layers number were investigated, and they were conducted the simulation, the experimental test and the contrastive analysis. It was found that the results of numerical simulation were consistent with the results of the experimental test.